The Best Led Heat Sink Aluminum of 2022 – Reviews & Buying Guide
After hours researching and comparing all models on the market, we find out the Best Led Heat Sink Aluminum of 2022. Check our ranking below.
2,081 Reviews Scanned
- Round Aluminum Heatsink for LED, Diode, Power Electronics
- ID (inside diameter): 0.23 inch / 6mm
- OD (Outside diamter): 0.8 inch / 20mm
- Thickness: 0.8 inch / 20mm
- Material: Aluminum
- [Large Area Heat Dissipation]: The fins increase the area of the board and thus provide for greater heat transfer.The aluminum heat sink can significantly reduce the hardware failure due to overheating and the design of the largest surface area can ensure contact with cooling air.
- [Wide Application]: Cooling Accessary is designed for high-power home LED lights or aquarium LED devices. Suitable for IC circuit board, motherboard, triode, MOS tube, T0-3P high power tube, heat sink, electronic for Audio amplifier, module, power supply block, air-cooled aluminum heat sink
- [Heatsink Specification]: SIZE: 300*140*20mm / 11.81*5.51*0.78"（Please make sure that the size of the heat sink fits that of your component）
- [Preventing overheating]: The heat sink is a passive heat exchanger that transfers heat generated by the electronics, allowing the temperature of the device to be adjusted to an optimum level. Aluminum heat sinks can reduce the risk of hardware failure due to overheating.
- [High Quality Aluminum Material]: Large heat sink is made from high-quality aluminum alloy, heat sink has excellent thermal conductivity and high hardness.
- 6 Pieces Aluminum Heat Sink
- Size: 4" x 1" x 0.4"/100mm*25mm*10mm (L*W*H)
- Unit weight : 33g
- Can be used for cooling LED, Power IC and Transistors, etc
- 1. Heatsink Material: Anodized aluminum heat sinks, substrate leveling and thick enough. Smooth surface without scratches and burrs
- 2. Heat sink Size: 1.57x1.57x0.79inch /40 x 40 x 20mm
- 3. Weight: 1.45 oz / 41g per; Fin: 11PCS; Base Board thicknesses: 0.17inch; Fin thicknesses: 0.05inch; Fin Spacing: 0.1inch
- 4. Use for: Cooling for electronic IC chip 3D printer stepper motor, NEMA17, TEC1-12706 Thermoelectric Peltier Cooler, power electric device, LED light, regulator devices, 50 amp bridge rectifiers and Chromecast etc.
- 5. Thermal conductive glue adhesive paste is the good partner to install the heat sink (gel is not included in the package)
- 1. Made of high quality Aluminum ( anodized aluminum), good thermal conductivity.
- 2. Size: 200 x 220 x 18mm / 7.87" x 8.66" x 0.7"; Weight : 988g,Base board thickness:3.1mm, Fins board thickness:2.5mm.
- 3. Large Heat sink Cooling Fin / Large Heat Sync, reduce the risk of hardware failure due to overheating.
- 4. Maximize surface area Designed in contact with the cooling air. The 30 pcs fins increase the area of the board and thus provide for greater heat transfer.
- 5. Specially designed for high power household LED light or fish tank LED devices, networking switch, for laptop, etc
- Material: Heat sink made of high quality Aluminum, good thermal conductivity, it is the first choice of heat dissipation materials.
- Large Area Heat Dissipation: Maximize surface area designed in contact with the cooling air. The 8pcs fins increase the area of the board and thus provide for greater heat transfered.
- Preventing Overheating: Aluminum heatsink can reduce the power loss of the device, provide efficient heat dissipation for electronic devices and other components, which prevent overheating and damage caused by excess heat.
- Versatile Use: Aluminum chipset heatsink can be used in a variety of applications, such as computer, LED light devices, power transistor, FET, IC, power amplifier, voltage regulator, power electric device, Mosfet etc..
- Heatsink Specification: Small in size, light in weight. Size: 100x25x10mm/ 4" x 1" x 0.4"(L*W*H). Net weight: 12.2oz. Package content: 10 x heatsinks.
- SIZE: Total Size: 80mm x 80mm x 27mm / 3.15'' x 3.15'' x 1.06'' (L*W*H)
- Weight : 7.4 oz ; Base board thickness:6 mm ; Fins board thickness:0.8mm; Fins:26Pcs
- Widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc
- FEATURE: Made of aluminum alloy material, it has a long service life, and corrosion resistance, and the heat dissipation capacity is strong, which can better dissipate heat for various equipment.
- FUNCTION: The surface is smooth, which is easy to install.
- 1. Product Name: Heat sink Cooling Fin; Material: Aluminium; 310g /pc （Sufficient materials only for excellent quality）
- 2. Size: 5.9 x 3.66 x 0.59 inch / 150 x 93 x 15mm (L*W*H)
- 3. The Quantity of fins: 294pcs; Base board thickness:4.3mm, Fins board thickness:2mm; Color:Black. The fins increase the area of the board and thus provide for greater heat transfer.
- 4. This large big aluminum heatsink is passive cooling, reduces the risk of hardware failure and power loss due to overheating, more safety.
- 5. Widely used in Computers GPU HDD etc., for Power Transistors, FETs, ICs, Power Amplifiers, Docking Station, Wifi Routers, Voltage Regulators, MOSFETs, SCRs, FET, IC etc
- Material: Heat sink made of high quality Aluminum, good thermal conductivity, it is the first choice of heat dissipation materials.
- Large Area Heat Dissipation: Maximize surface area designed in contact with the cooling air. The 8pcs fins increase the area of the board and thus provide for greater heat transfered.
- Preventing Overheating: Aluminum heatsink can reduce the power loss of the device, provide efficient heat dissipation for electronic devices and other components, which prevent overheating and damage caused by excess heat.
- Versatile Use: Aluminum chipset heatsink can be used in a variety of applications, such as computer, LED light devices, power transistor, FET, IC, power amplifier, voltage regulator, power electric device, Mosfet etc..
- Heatsink Specification: Small in size, light in weight. Size: 100x25x10mm/ 4" x 1" x 0.4"(L*W*H). Net weight: 6.1oz. Package content: 5 x heatsinks.
- Material:Made of Aluminum, good thermal conductivity, it is the first choice of heat dissipation materials
- The larger the area of the radiator, the better the cooling effect,the 19pcs fins increase the area of the board and thus provide for greater heat transfer
- It can reduce the power loss of the device,provide an of occupied space for the device and improve the environment
- Overall Size : 11.81"(L) x 5.51"(W) x 0.78"(H) / 300mm (L)x 140mm(W) x 20mm(H)
- Widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc.
Last update on 2025-08-06 / Affiliate links / Images from Amazon Product Advertising API
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